CMC 2011 Proceedings has been indexed in Ei Compendex (screen capture) and included in IEEE Xplore (screen capture)
2011 3rd International Conference on Communications and
Mobile Computing (CMC 2011)
Shaw Building, SDUST, Qingdao, China
April 18-20, 2011
Call for Papers & Expo
CMC 2011 intends to be a global forum for researchers and engineers to present and discuss recent advances and new techniques in communications and mobile computing. We invite you to submit your original papers on the most recent results and technology trends to one of the 5 symposiums.
CMC 2011 conference proceedings will be published by the Conference Publishing Services (CPS) which will include the conference proceedings in the IEEE Xplore and submit to Ei Compendex and ISTP for indexing (CMC 2009 and CMC 2010 proceedings were already indexed in Ei Compendex and included in IEEE Xplore). The registration fee of US$410 or CNY 2700 includes lunches, coffee breaks, and banquet.
CMC 2011 is organized by the College of Information &
Electrical Engineering, Shandong University of Science & Technology,
China. In addition to research papers, CMC 2011 also seeks
exhibitions of modern products and equipment for communications and
mobile computing.
Qingdao is a picturesque city that lies on the southern tip of China's Shandong Peninsula, facing the Yellow Sea. Qingdao is well known for its European architecture and attractive coastal landscape. Its abundance of natural beauty, numerous tourist attractions, and mild climate make Qingdao an ideal holiday destination both at home and abroad. In 2008, Qingdao was named China's 7th-most livable city.
If you have any questions, please email us at cmc2011 <AT> sdust.edu.cn or call +86-532-86057654 (office), +8613969636531 (mobile).
Important Dates:
Paper Submission Deadline: 15 October 2010
15 November 2010 (Extended)
Review Notification: 15 November 2010
15 December 2010
Final Papers and Author Registration Deadline: 15 December 2010
11 January 2011
CMC 2011 Organizing Committee
General Chair:
Dongfeng YUAN, Shandong University, China
General Vice-Chair:
Maoyong CAO, Shandong University of Science and Technology, China
TPC Chair:
Cheng-Xiang WANG, Heriot-Watt University, UK
TPC Vice-Chair:
Hua HUANG, Huawei Technologies Co. Ltd., China
Local Organizing Committee Chair:
Yinjing GUO, Shandong University of Science and Technology, China
Local Organizing Committee Vice-Chair:
Xubao SUN, Shandong University of Science and Technology, China
Publication Chairs:
Ezzat Kirmani, St. Cloud State University, USA
Rakhesh Singh Kshetrimayum, Indian Institute of Technology Guwahati,
India
Publicity Chairs:
Yejun HE, Shenzhen University, China
Xuemin HONG, Heriot-Watt University, UK
International Advisory Committee:
Andy MOLISCH, University of Southern California, USA
Fumiyuki ADACHI, Tohoku University, Japan
Weixin XIE, Shenzhen University, China
Pingzhi FAN, Southwest Jiaotong University, China
Xuemin (Sherman) SHEN, University of Waterloo, Canada
Ivan ANDONOVIC, University of Strathclyde, UK
Symposium Chairs:
1. Wireless Communications Symposium
Chair: Hsiao-Chun WU, Louisiana State University, USA
Vice-Chairs:
Wen XU, Infineon Technologies AG, Germany
Xiang CHENG, Peking University, China
Xiaojing HUANG, CSIRO, Australia
2. Wireless Networking Symposium
Chair: Pingyi FAN, Tsinghua University, China
Vice-Chairs:
Jie LI, University of Tsukuba, Japan
Kun YANG, University of Essex, UK
Xiaohu GE, Huazhong University of Science and Technology, China
3. Optical Communications and Networking Symposium
Chair: Alan Pak Tao LAU, Hong Kong Polytechnic University, China
Vice-Chairs:
Prof. Chao Lu, The Hong Kong Polytechnic University, China
Prof. Calvin C. K. Chan, The Chinese University of Hong Kong, China
4. Mobile Computing and Internet Symposium
Chair: Zhili SUN, University of Surrey, UK
Vice-Chairs:
Yan ZHANG, Simula Research Laboratory, Norway
Gang WU, UESTC, China
Guoqiang MAO, The University of Sydney, Australia
5. Computer and Network Security Symposium
Chair: Cheng LI, Memorial University of Newfoundland, Canada
Vice-Chair:
Vojislav B. MISIC, Ryerson University, Canada
Yassir Nawaz, Pitney Bowes, USA
